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- English · 原文Some updates on bottleneck timelines: - ABF substrates: 1 year / eg. Ajinomoto (2802) for ABF film, Ibiden, Unimicron, Nan Ya PCB, etc make the substrates - HDI Boards: Over 6 months / Victory Giant (300476), Zhen Ding (4958), Unimicron, Compeq (2313), Meiko (6787) - Multilayer boards: ~6 months / Victory Giant, WUS (002463), $TTMI, Gold Circuit Electronics (2368), - CCL: Over 6 months (severe shortages of materials) / Elite Material (2383), Shengyi (600183), TUC (6274), ITEQ (6213), Nan Ya Plastics (1303), Resonac (4004) Mitsui Kinzoku (5706) / HVLP copper foil. Nittobo / glass fiber/cloth - MLCCs, chip resistors, tantalum capacitors, aluminum electrolytic capacitors: 15-20 weeks to 1 year+ MLCC: Murata (6981), Samsung Electro-Mechanics, TDK (6762), Taiyo Yuden (6976), Yageo (2327), Walsin (2492) Chip Resistors: Yageo, Walsin, KOA (6999), Rohm (6963) and $VSH Tantalum capacitors: Kyocera/AVX, Yageo/KEMET, $VSH again Aluminum electrolytic capacitors: Nippon Chemi-Con (6997) Nichicon (6996) | Timelines sourced from Digitimes, did the honors of adding in related companies. But it's slightly more nuanced since MLCCs and others mix. in commodity types vs. AI DCs. Regardless, just some helpful mapping.中文 · 翻译关于瓶颈交期的一些最新情况: - ABF 载板:1 年 / 例如,Ajinomoto (2802) 提供 ABF 膜,Ibiden、Unimicron、Nan Ya PCB 等生产载板 - HDI 板:超过 6 个月 / Victory Giant (300476)、Zhen Ding (4958)、Unimicron、Compeq (2313)、Meiko (6787) - 多层板:约 6 个月 / Victory Giant、WUS (002463)、$TTMI、Gold Circuit Electronics (2368) - CCL(覆铜板):超过 6 个月(材料严重短缺) / Elite Material (2383)、Shengyi (600183)、TUC (6274)、ITEQ (6213)、Nan Ya Plastics (1303)、Resonac (4004) Mitsui Kinzoku (5706) / HVLP 铜箔。 Nittobo / 玻璃纤维/布 - MLCC、贴片电阻、钽电容、铝电解电容:15-20 周到 1 年多 MLCC:Murata (6981)、Samsung Electro-Mechanics、TDK (6762)、Taiyo Yuden (6976)、Yageo (2327)、Walsin (2492) 贴片电阻:Yageo、Walsin、KOA (6999)、Rohm (6963) 和 $VSH 钽电容:Kyocera/AVX、Yageo/KEMET、$VSH 又来了 铝电解电容:Nippon Chemi-Con (6997) Nichicon (6996) | 交期信息来自 Digitimes,我帮忙添加了相关公司。 不过情况稍微复杂一点,因为 MLCC 和其他元件在通用型和 AI 数据中心用型之间有所区别。 不管怎样,这算是一些有用的映射。